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oki semiconducto r fedl6585-02 iss ue date: jun. 2004 msM6585 adpcm voice synthesis ic 1 general description the msM6585 is an version-up product of the msm5205 voice synthesis ic. mainly improved points are improvement for the precision of an internal da converter, a built-in low-pass filter, and expansion on the sampling frequency. the msM6585 does not include a control circuit to drive an external memory similar to the msm5205. therefore, the msM6585 can be connected with not only semiconductor memories, but other memory media (cd-rom, etc.) by the control of cpu. features ? 4-bit adpcm method ? built-in 12-bit da converter ? built-in low-pass filter (lpf) (C40db/oct) ? sampling frequencies: 4k/8k/16k/32khz ? master clock frequency (ceramic oscillator) : 640khz ? voice data synthesis: supported by voice analysis editing tool ar207 ? package options: 18-pin plastic dip (dip18-p-300-2.54) (msM6585rs) 24-pin plastic sop (sop24-p- 430-1.27-k) (msM6585mazxxx) 30-pin plastic ssop (ssop30- p-56-0.65-k) (msM6585mbzxxx) differences between msM6585 and msm5205 msM6585 msm5205 ? master clock frequency: 640khz 384khz ? sampling frequency: 4k/8k/16k/32khz 4k/6k/8khz ? adpcm bit length: 4-bit 3-bit/4-bit ? da converter: 12-bit 10-bit ? low-pass filter: included (C40db/oct) not included ? overflow preventing circuit: included not included ? power supply voltage: 4.5 to 5.5v 3.0 to 6.0v ? operating current consumption: 10ma 4ma ? operating temperature: C40 to +85 c C30 to +70 c ? d3 to d0 input timing vck (o) d3 - d0 input timing adpcm data msM6585 msm5205
? semiconductor 2 msM6585 block diagram C + d3 d2 d1 d0 aout dao v dd gnd 412 4-bit latch adpcm synthesizer 12-bit dac lpf osc timing controller test circuit xt xt s1 s2 reset vck t1 t2 t3 t4
? semiconductor 3 msM6585 pin configuration (top view) 18-pin plastic dip s1 s2 t3 d0 d1 d2 d3 t4 gnd v dd xt xt reset vck t2 t1 dao aout 1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 1 2 3 4 5 6 7 8 9 10 11 12 s1 s2 t3 nc d0 nc d1 d2 nc d3 t4 gnd v dd xt xt nc reset nc vck t2 t1 nc dao aout 24 23 22 21 20 19 18 17 16 15 14 13 nc : no connection 24-pin plastic sop 1 2 3 4 5 6 7 8 9 10 11 12 s1 s2 nc nc nc t3 d0 d1 d2 d3 nc nc v dd xt nc nc nc xt reset vck t2 t1 nc nc 30 29 28 27 26 25 24 23 22 21 20 19 nc : no connection 30-pin plastic ssop 13 14 15 nc t4 gnd nc dao aout 18 17 16
? semiconductor 4 msM6585 pin description symbol type description s1 i pins to determine the sampling frequency. the sampling frequencies of 32k, 16k, 8k, and 4khz can be selected by combinations. (see the sampling frequencies in functional description on the selection of combinations.) t3 i pin to test the internal circuit. set this pin to a high level or make it open because it has a built-in pull-up resistor. d0-d3 i input pins for adpcm data. t4 o pin to test the internal circuit. make this pin open. gnd ground pin aout o pin to output the analog voice from the low-pass filter. connect a 0.01 m f capacitor to this pin. (see the aout connecting circuit in functional description on the connecting circuit.) dao o pin to output the analog voice from the da converter. t1 i pins to test the internal circuit. set these pins to a low level or make them open because pull-down resistors are included. vck o this pin outputs the sampling frequency selected by the combinations of s1 and s2. the voice synthesis starts or stops by synchronizing with vck . reset i reset pin. the voice synthesis circuit is initialized by synchronizing with vck . if this pin is set to a high level, the d0 to d3 data inputs are disabled by synchronizing with vck . the aout and da0 pins output 1/2 v dd and become the state of no voice. xt i pin to connect an oscillator. when the external clock is used, input it from this pin. xt o pin to connect an oscillator. when the external clock is used, make this pin open. v dd power supply pin. insert a bypass capacitor of 0.1 m f or more between this pin and the gnd pin. dip sop ssop 111 s2 222 336 4-7 5, 7, 8, 10 7-10 81114 91215 10 13 16 11 14 17 12 16 21 t2 13 17 22 14 18 23 15 20 24 16 22 25 17 23 29 18 24 30 pin pin to test the internal circuit. make this pin open.
? semiconductor 5 msM6585 absolute maximum ratings condition ta = 25c ta = 25c rating C0.3 to +7.0 C0.3 to v dd +0.3 C55 to +150 unit v v c symbol v dd v in t stg parameter power supply voltage input voltage storage temperature (gnd=0 v) recommended operating conditions electrical characteristics dc characteristics min. 0.8 v dd C0.1 v dd C0.4 20 C400 C10 C20 10 50 typ. 150 C120 5 max. v dd +0.1 0.2 v dd 0.4 400 10 20 C20 10 40 40 "h" input voltage condition unit v v v v m a m a m a m a m a m a ma mv k w k w symbol vck: i oh = C40 m a vck: i ol = 40 m a t1, t2, reset: v ih = v dd s1, s2, d0 - d3, t3: v ih = v dd xt: v ih = v dd t3: v il = 0v s1, s2, d0 - d3, t1, t2, reset: v il =0v xt=v il =0v f osc =640khz, no load no load parameter "l" input voltage "h" output voltage "l" output voltage "h" input current "h" input current "h" input current "l" input current "l" input current "l" input current current consumption da output relative error da output impedance lpf load resistance v ih v il v oh v ol i ih1 i ih2 i ih3 i il1 i il2 i il3 i dd | v dae | r dao r aout (v dd =4.5 to 5.5v, gnd=0v, ta=C40 to +85c) condition range unit symbol parameter power supply voltage operating temperature master clock frequency 4.5 to 5.5 v v dd C40 to +85 c t op oscillator connection 640 khz f osc (gnd = 0v)
? semiconductor 6 msM6585 ac characteristics min. typ. max. parameter unit symbol condition t vck = 250 m s = 125 m s = 62.5 m s =31.25 m s f sam = 4khz ... = 8khz ... =16khz ... =32khz ... original oscillation duty cycle reset input pulse width data setup time data hold time t w(rst) t s t h f duty 2 t vck t vck /2 3 m s m s m s 50 60 % 40 when data is shared with the msm5205, note that the d3 to d0 selection timings of the msM6585 and msm5205 are different. (refer to differences between msM6585 and msm5205.) timing diagram the vck clock rising and falling edges are reversed between the msm5205 and the msm6588, as indicated in differences between msM6585 and msm5205. note that the msM6585 cannot accept data if the msm5205 controls to repeat valid and invalid each half cycle, when the msm5205 is replaced with the msM6585. t vck t w(rst) t h t s t vck/8 vck (o) reset (i) d3 - d0 (i) ic internald3 - d0 selection timings aout, dao (o) adpcm1 adpcm2 adpcmn adpcm n+1
? semiconductor 7 msM6585 functional description 1. sampling frequency the relationship of the sampling frequencies on s1 and s2, and the cutoff frequencies are listed below. cutoff frequency (f cut ) 1.6 khz 3.2 khz 6.4 khz 12.8 khz sampling frequency (f sam ) 4 khz 8 khz 16 khz 32 khz s2 l l h h s1 l h l h 2. aout connecting circuit connect a 0.01 m f capacitor to the aout pin. the circuit diagram is as shown below. aout 0.01 m f msM6585 amplifier speaker even when the dao pin is used, connect a 0.01 m f capacitor to the aout pin. this capacitor is used for the improvement of a voice quality. 3. voice output the msM6585 has two voice output pins. the dao is direct output pin from the internal da converter. the aout is a pin to output a voice after which the dao output passed a built-in lpf. 3.1 da converter output waveform the output amplitude from the da converter is max. (4095/4096) v dd and becomes a stair step waveform synchronized with the sampling frequency. the dao output impedance varies in the ranges from 10k w to 40k w . therefore, determine the filter constant so that the resistor variation does not have influence on the cutoff frequency of the filter.
? semiconductor 8 msM6585 3.2 low-pass filter output the cutoff frequency of the low-pass filter varies in proportion to the sampling frequency. the following figure shows the low-pass filter characteristics in the sampling frequency 8khz. 4. oscillation following show external circuit diagrams using a ceramic resonator, kbr-640b made by kyocera corp. and csb640p made by murata mfg. co., ltd. 0 C20 C40 C60 100 1k 10k fre q uenc y ( hz ) damping factor (db) xt xt 640khz 220pf msM6585 220pf kyocera corp. kbr-640b used xt xt 640khz 100pf msM6585 100pf murata mfg. corp. csb640p used 1m w
? semiconductor 9 msM6585 application circuits centronics interface circuit (sampling frequency : 8khz) busy strobe reset d0 d1 d2 d3 d4 d5 d6 d7 0.1 m f 7 5 3 1 6 4 2 15 9 8 14 16 13 12 11 10 12 9 13 14 4 1 6 3 5 8 7 10 2 11 s1 aout 640khz d1 d0 0.01 m f amp msM6585 adpcm decoder msm4013 msm4019 +5v 0.1 m f 0.1 m f t3 v dd dao xt xt d2 d3 reset vck t4 t1 s2 gnd t2 centronics timing chart reset res data strobe vck ka kb busy min250 m sec 125 m sec first byte high nibble low nibble
? semiconductor 10 msM6585 example of interface circuit with 256k-bit eprom the circuit example and timing diagram that used the 256k-bit eprom are shown below. msm27256 ce a 0 - a 10 a 11 a 12 a 13 a 14 o 0 o 4 o 1 o 5 o 2 o 6 o 3 o 7 o 0 - o 11 o 12 cl msm4013 b 1 a 1 reset b 2 a 2 b 3 b 4 a 3 a 4 kb msm4019 ka d 1 d 2 d 3 d 4 s 1 q 2 d 2 q 2 cl 1 cl 2 msm4013 r 1 d 1 s 2 q 1 r 2 d0 d1 d2 d3 xt xt msM6585 reset s2 s1 aout 640khz 0.01 m f 100k w q 1 q 2 q 3 msm4040 reset q 4 start sw 10k w 0.1 m f 100k w (msm4025) 11 M6585 vck (o) start sw m4013 s 1 m4013 q 1 m4013 q 2 q 2 m4040 q 1 q 2 q 12 m4040 q 3 q 4 cl (M6585 reset) (lower 4-bit) (upper 4-bit) vck
? semiconductor 11 msM6585 pad configuration pad layout product name msM6585 function adpcm voice synthesis ic die size = 2.92 mm, y = 3.58 mm die thickness 350 m m 30 m m pad size 130 m m 130 m m substrate voltage gnd y x 8 7 3 2 1 20 17 16 13 12 pad coordiantes (the die center is located at x=0, y=0) pad no. pad name x-axis y-axis pad no. pad name x-axis y-axis 1 s1 377 C1635 11 aout 38 1635 2 s2 819 C1635 12 dao C1125 1635 3 t3 1305 C1635 13 t1 C1305 1579 4 d0 1305 C943 14 t2 C1305 1009 5 d1 1305 44 15 vck C1305 C88 6 d2 1305 1095 16 reset C1305 C818 7 d3 1305 1635 17 xt C1281 C1635 8 t4 830 1635 18 xt C529 C1635 9av ss 447 1580 19 v dd C299 C1549 (unit: m m) 10 v ss 267 1580 20 av dd C119 C1549
? semiconductor 12 msM6585 (unit : mm) package dimensions dip18-p-300-2.54 package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 1.30 typ.
? semiconductor 13 msM6585 (unit : mm) notes for mounting the surface mount type package the sop, qfp, tsop, tqfp, lqfp, soj, qfj (plcc), shp, and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). sop24-p-430-1.27-k package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 0.58 typ. mirror finish
? semiconductor 14 msM6585 (unit : mm) notes for mounting the surface mount type package the sop, qfp, tsop, tqfp, lqfp, soj, qfj (plcc), shp, and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). ssop30-p-56-0.65-k package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 0.19 typ. mirror finish
1 semiconductor msm658 5 15 revision history page document no. date previous edition current edition description e2d0011-39-91 sep. 1999 ? ? final edition 1 ? ? final edition 2 1 1 changed the voice analysis editing tools from ar203 and ar204 to ar207. fedl6585-02 jun. 2004 1 1 changed the package product names from msM6585gs-k and msM6585gs-ak to msM6585mazxxx and msM6585mbzxxx, respectively.
1 semiconductor msm658 5 16 notice 1. the information contained herein can change without notice owing to product and/or technical improvements. before using the product, please make sure that the information being referred to is up-to-date. 2. the outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. when planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. when designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. neither indemnity against nor license of a third party?s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. no responsibility is assumed by us for any infringement of a third party?s right which may result from the use thereof. 6. the products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). these products are not, unless specifically authorized by oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. certain products in this document may need government approval before they can be exported to particular countries. the purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and n ecessary steps at their own expense for these. 8. no part of the contents contained herein may be reprinted or reproduced without our prior permission. copyright 2004 oki electric industry co., ltd.

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